Scientific Instruments and Equipments


Xeva-2.5-320: Superior performance for reliable research.

The Xeva-2.5-320 is a short wave infrared camera that employs a 320x256 HgCdTe FPA. The Xeva SWIR camera head interfaces to a PC via CameraLink or USB 2.0.

! Update: the camera is now also available at 200 Hz framerate


  • HgCdTe detector
  • 0.85 to 2.5 µm sensitivity
  • 320 x 256 pixels
  • Framerate 60Hz, 100Hz or new at 200Hz
  • USB 2.0 or CameraLink interface
  • Four-stage Peltier cooler
  • External trigger input

Xeva-2.5-320: Superior performance, reliable research

The Xeva-2.5-320 unit is a compact digital camera, operating a HgCdTe detectyor array (up to 2.5 µm) with 320 x 256 pixel resolution. It outputs 14 bit data and comes in a 60 Hz, 100 Hz or 200 Hz version.

The camera interfaces to a PC via standard USB 2.0 or CameraLink and comes with a custom frame grabber card or can interface to standard frame grabber cards such as the NI-1428.

Each camera is delivered with a graphical user interface Xeneth, which offers direct access to various camera settings such as exposure time and operating temperature. Through its advanced thermo-mechanical design, the Xeva-2.5-320 achieves excellent performance levels using a TE4-cooled device operating down to 200K or below.

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Xeva-2.5-320: Detailed specifications

 Array Specifications

Xeva-2.5-320

 Array type

 HgCdTe

 Spectral band

 0.85 µm to 2.5 µm

 # Pixels

 320 x 256

 Array operability

 30 µm

 Array cooling

 TE4

 Pixel operability

 > 99%

 Camera  Specifications

60 Hz

100 Hz

200 Hz

 Lens (Included)

 

 

 

 Focal length

16mm f/1.4 16mm f/1.4 16mm f/1.4

 Optical interface

C-mount, spectrograph fixation holes

C-mount, spectrograph fixation holes

C-mount, spectrograph fixation holes

 Imaging Performance

 

 

 

 Frame rate: Video rate

60 Hz

100 Hz

200 Hz

 Integration type

Snapshot Snapshot Snapshot

 Exposure time range

100 µs up to 20 msec 100 µs up to 20 msec 100 µs up to 20 msec
 Noise level 6 AD counts 6 AD counts 6 AD counts
 S/N ratio 69 dB 69 dB 69 dB
  A to D conversion resolution 14 bit

 14 bit

14 bit

 Interfaces

 

 

 

 Camera control

USB 2.0

USB 2.0

USB 2.0

 Image acquisition

CameraLink

CameraLink

CameraLink

 Trigger

TTL levels TTL levels TTl levels

 Graphical User Interface (GUI)

Xeneth Advanced

Xeneth Advanced Xeneth Advanced

 Power Requirements

 

 

 

 Power consumption

< 4W

Cooler: Max. 30W

< 4W

Cooler: Max. 30W

< 4W

Cooler: Max. 30W

 Input voltage

12 V - 5 A

12 V - 5 A

12 V - 5 A

 Physical Characteristics

 

 

 

Camera cooling

Forced convection cooling

Forced convection cooling

Forced convection cooling

 Cool-down time < 300 sec < 300 sec < 300 sec

 Ambient operating  temperatures

0 to 50 °C

0 to 50 °C

0 to 50 °C

  Dimensions

110 x 90 x 110 mm³

110 x 90 x 110 mm³

110 x 90 x 110 mm³

 Weight camera head

app. 1.8 kg

app. 1.8 kg

app. 1.8 kg

 Weight power supply 300 g 300 g 300 g

 Software Specifications

 Xeva-2.5-320

 X-control Advanced

 Image live view

 Store digital pictures/movies

 Image histogram

 Line profiles, Spot meters,  Time profiles

 Subframe dimension and position

 Digital zoom

 Black hot / White hot

 False color mode with various color patterns

 Advanced image processing features:

   - image averaging

   - auto or manual gain control

   - advanced filters

 Xeneth SDK

 Installer package for Windows (dll's) platform,  operability with C, C++, C#, VB.Net (Visual Studio),  Visual Basic and Delphi

 Installer package for Linux (.so), operability with C  and C++ (gcc, ... SDK validated on Fedora 9.0)

 Sample code and hands on for Labview

  X-control Radiometric (optional)

 Image live view

 Store digital pictures/movies

 Image histogram

 Line profiles, Spot meters, Time profiles

 Black hot / White hot

 False color mode with various color patterns

 Video output format selection: PAL or NTSC

 Thermography

Art Inspection

For some time already, infrared analysis has been used in art history and restoration technology to determine the presence of underdrawings and the physical state of a painting. Infrared analysis is used predominantly to identify underdrawings and overpaintings. Because of the low infrared absorption, the long-wave radiation offers an easy and above all non-destructive way of “seeing through” the top layers of paint to identify and analyze the underlying structures, outlines and previous versions.

 
Underdrawings can be found on many paintings from every era: They are scetches lying directly under the paint layers. They can be made visible using IR-reflectography. In most cases underdrawings are done with charcoal, pencil or brushstrokes. Later they disappear for the most part under the final layer of paint. Every painter uses underdrawings in their own individual ways, from simple outlines for perspective right through to detailed drawings. Therefore an underdrawing can also provide deeper insights into the creative work process of the artist. It is worthwhile subjecting IR methods and equipment thus far used for examining underdrawings to a critical test in respect of their cost-effectiveness and to check the advanced application possibilities of modern NIR cameras for accelerated image analysis.